| Abstract | Buildings account for roughly 30% of global final energy use and about 26% of energy-related CO₂ emissions, prompting many countries
to intensify mitigation efforts; in Korea, the Energy Saving Design Criteria are upgraded every 2–3 years. However, a large share of aging
apartments in the capital region suffers from degraded envelopes that increase heating/cooling loads and primary energy use, and the
thickness/space penalties and major retrofit requirements of conventional passive insulation underscore the need for active insulation
solutions. This study aims to verify the feasibility and energy benefits of applying a thermoelectric-Module based thermally activated
insulation panel (TAIP) to existing apartment walls. We propose a TAIP that lowers the effective U-value with minimal structural
changes; DesignBuilder simulations indicate 28% lower heating and 7.2% lower cooling, and when panel electricity is included 23% lower
total annual energy use. These results indicate a practical, scalable insulation solution for heat vulnerable buildings. |
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